Integrated circuit with mixed row heights

ABSTRACT

An integrated circuit structure includes: a first plurality of cell rows extending in a first direction, each of which has a first row height and comprises a plurality of first cells disposed therein; and a second plurality of cell rows extending in the first direction, each of which has a second row height different from the first row height and comprises a plurality of second cells disposed therein. The plurality of first cells comprises a first plurality of active regions each of which continuously extends across the plurality of first cells in the first direction, and wherein the plurality of second cells comprises a second plurality of active regions each of which continuously extends across the plurality of second cells in the first direction.

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims priority to U.S. Provisional PatentApplication No. 62/591,358, filed on Nov. 28, 2017, which isincorporated by reference herein in its entirety.

BACKGROUND

Generally, electronic design automation (EDA) tools assist semiconductordesigners to take a purely behavioral description of a desired circuitand work to fashion a finished layout of the circuit ready to bemanufactured. This process usually takes the behavioral description ofthe circuit and turns it into a functional description, which is thendecomposed into thousands of Boolean functions and mapped intorespective cell rows using a standard cell library. Once mapped, asynthesis is performed to turn the structural design into a physicallayout, a clock tree is built to synchronize the structural elements,and the design is optimized post layout.

In order to avoid misalignment across cells from respective differentcell libraries, a cell from a standard cell library is typically used,which has a cell height equal to the height of the cell row (hereinafter“row height”). As such, a decision is typically made at a relativelyearly design stage as to which “single” cell height to utilize for thedesign thereby fixing the corresponding row height as well. By usingonly a single cell height, however, some compromises between circuitperformance, circuit power, and the manufacturing process must be made.For example, a performance-orientated circuit may be formed by disposinga plurality of cells side-by-side along a cell row, each of which has ahigher number of active regions (e.g., fins); and apower/area-orientated circuit may be formed by disposing a plurality ofcells side-by-side along a cell row, each of which has a lower number ofactive regions.

Accordingly, in order to design a circuit required to consume low powerand occupy a small area without sacrificing its performance (e.g., abalance-orientated circuit), various design compromises are typicallymade. For example, a first plurality of cells having a lower number offins are alternatively disposed between a second plurality of cellshaving a higher number of active regions. Such a layout causes adiscontinuity on the extension of one or more of the active regions(typically known as “broken fins,” or more generally, “broken activeregions”) in the second plurality of cells, which can disadvantageouslylower the performance of the circuit (due to the relaxed strain/stresscaused by the broken fins). Thus, conventional techniques to design acircuit using cells are not entirely satisfactory.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that various features are not necessarily drawn to scale. In fact,the dimensions of the various features may be arbitrarily increased orreduced for clarity of discussion.

FIGS. 1A, 1B, and 1C respectively illustrate schematic diagrams ofexemplary integrated circuits designed by systems and methods of thepresent disclosure, in accordance with some embodiments of the presentdisclosure.

FIG. 2A illustrates a top view of a corresponding layout design of anexemplary integrated circuit at one or more first layout levels, inaccordance with some embodiments of the present disclosure.

FIG. 2B illustrates a top view of the corresponding layout design of theintegrated circuit at a second layout level above the one or more firstlayout levels, in accordance with some embodiments of the presentdisclosure.

FIGS. 2C, 2D, 2E and 2F each illustrates a part of a correspondingcross-sectional view of some cells of the integrated circuit, inaccordance with some embodiments of the present disclosure.

FIG. 2G illustrates a top view of another corresponding layout design ofthe exemplary integrated circuit at one or more first layout levels, inaccordance with some embodiments of the present disclosure.

FIG. 3 illustrates a block diagram of an exemplary information handlingsystem (IHS), in accordance with some embodiments of the presentdisclosure.

FIG. 4 illustrates a flow chart of an exemplary method performed by theIHS to generate a physical layout of an integrated circuit that includesmixed row heights, in accordance with some embodiments of the presentdisclosure.

FIG. 5 illustrates different applications for various mixed row designscenarios, in accordance with some embodiments of the presentdisclosure.

FIG. 6 illustrates an exemplary procedure for designing an integratedcircuit that includes mixed row heights, in accordance with someembodiments of the present disclosure.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

The following disclosure describes various exemplary embodiments forimplementing different features of the subject matter. Specific examplesof components and arrangements are described below to simplify thepresent disclosure. These are, of course, merely examples and are notintended to be limiting. For example, the formation of a first featureover or on a second feature in the description that follows may includeembodiments in which the first and second features are formed in directcontact, and may also include embodiments in which additional featuresmay be formed between the first and second features, such that the firstand second features may not be in direct contact. In addition, thepresent disclosure may repeat reference numerals and/or letters in thevarious examples. This repetition is for the purpose of simplicity andclarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

The present disclosure provides various embodiments of systems andmethods to design a circuit using a plurality of cell rows, or rows,each of which includes one or more cells that are disposed side-by-sidealong a first direction and each has a same number of active regions(e.g., fins) extending along the first direction. More specifically, therespective active regions, disposed within each row, each continuouslyextends across the one or more cells. Further, according to someembodiments, such a plurality of rows can be disposed along a seconddirection substantially orthogonal to the first direction, and may haveat least two respective different row heights. In other words, the cellsdisposed within the respective rows having the different row heightshave different numbers of active regions. As such, various circuits,each of which can be used in respective different applications (e.g., aperformance-orientated application, a power/area-orientated application,a balance-orientated application, etc.) can be designed using thedisclosed systems and methods without having the broken fin issuetypically encountered by existing techniques, as mentioned above.

FIGS. 1A, 1B, 1C respectively illustrate schematic diagrams of exemplaryintegrated circuits 100, 140, and 180 designed by systems and methods ofthe present disclosure, in accordance with some embodiments. Not all ofthe illustrated components are required, however, and some embodimentsof the present disclosure may include additional components not shown inFIGS. 1A-C. Variations in the arrangement and type of the components maybe made without departing from the scope of the present disclosure asset forth herein. Additional, different or fewer components may beincluded.

Referring first to FIG. 1A, the integrated circuit 100 includes cellgroups 100-1, 100-2, 100-3, 100-4, and 100-5 arranged (e.g., laid out)in respective “cell rows” or “rows” with respect to a grid 101. Further,in some embodiments, each cell group includes one or more (standard)cells disposed side-by-side along the respective row. For example, thecell group 100-1 including cells 100-1 a, 100-1 b, 100-1 c, and 100-1 dthat are arranged in row 1 of the grid 101; the cell group 100-2including cells 100-2 a, 100-2 b, 100-2 c, and 100-2 d that are arrangedin row 2 of the grid 101; the cell group 100-3 including cells 100-3 a,100-3 b, 100-3 c, and 100-3 d that are arranged in row 3 of the grid101; the cell group 100-4 including cells 100-4 a, 100-4 b, 100-4 c, and100-4 d that are arranged in row 4 of the grid 101; and the cell group100-5 including cells 100-5 a, 100-5 b, 100-5 c, and 100-5 d that arearranged in row 5 of the grid 101.

In some embodiments, the rows of the integrated circuit 100 may presentat least two respective different “row heights.” As shown, the rows 1,2, 4, and 5 may share a substantially similar row height, hereinafter“row height A;” and the row 3 may have a row height, hereinafter “rowheight B,” wherein the row height A is greater than the row height B. Insome embodiments, such a row height corresponds to the cell height of acell placed therein, which will be discussed as follows.

In some embodiments, the cells of the cell groups 100-1, 100-2, 100-3,100-4, and 100-5 are retrieved from respective standard cell librarieshaving different cell heights. More specifically, the cells of the cellgroups 100-1, 100-2, 100-4, and 100-5 may be retrieved from a firststandard cell library (hereinafter “cell library A”) including aplurality of cells, each of which share a first cell height (hereinafter“cell height A”); and the cells of the cell group 100-3 may be retrievedfrom a second standard cell library (hereinafter “cell library B”)including a plurality of cells, each of which share a second cell height(hereinafter “cell height B”). Alternatively stated, the cells 100-1 ato 100-1 d, 100-2 a to 100-2 d, 100-4 a to 100-4 d, and 100-5 a to 100-5d are a subset of the cell library A, and the cells 100-3 a to 100-3 dare a subset of the cell library B. Each of the cells 100-1 a to 100-1d, 100-2 a to 100-2 d, 100-4 a to 100-4 d, and 100-5 a to 100-5 d in thecell library A and the cells 100-3 a to 100-3 d in the cell library B isassociated with a specific logic function and/or characteristic (e.g., atiming characteristic). Accordingly, it is noted that although the cells100-1 a to 100-1 d, 100-2 a to 100-2 d, 100-4 a to 100-4 d, and 100-5 ato 100-5 d are retrieved from the cell library A, not all of them sharea same cell width, for which the cells 100-3 a to 100-3 d of the celllibrary B are similar. In some embodiments, by arranging the cell groups100-1 to 100-5 as shown, the integrated circuit 100 may present aspecific characteristic, e.g., a speed-orientated circuit, abalance-orientated circuit, or a power/area-orientated circuit, whichwill be discussed in further detail below.

As mentioned above, the row height of each row corresponds to the cellheight of a cell placed therein. In some embodiments, the row height ofeach row is substantially close to the cell height of the cell placedtherein. Further, the cell height of each of the cells of the cellgroups 100-1 to 100-5 may correspond to a number of active region(s)continuously running in a first direction (e.g., the X direction) anddisposed along a second direction (e.g., the Y direction). In someembodiments, such an active region may be a fin-shaped region of one ormore three-dimensional field-effect-transistors (e.g., FinFETs,gate-all-around (GAA) transistors), or an oxide-definition (OD) regionof one or more planar metal-oxide-semiconductor field-effect-transistors(MOSFETs), wherein the active region may serve as a source feature ordrain feature of the respective transistor(s). For example, the cellheight A of the cells 100-1 a to 100-d, 100-2 a to 100-2 d, 100-4 a to100-4 d, and 100-5 a to 100-5 d may correspond to a higher number ofactive regions disposed along the Y direction; and the cell height B ofthe cells 100-3 a to 103-d may correspond to a lower number of activeregions along the Y direction, which will be shown and discussed belowin further detail with respect to FIG. 2A.

Referring to FIG. 1B, the integrated circuit 140 includes cell groups140-1, 140-2, 140-3, 140-4, 140-5, 140-6, 140-7, and 140-8 arranged(e.g., laid out) in respective “rows” with respect to a grid 141. Forexample, the cell group 140-1 including cells 140-1 a, 140-1 b, 140-1 c,and 140-1 d that are arranged in row 1 of the grid 141; the cell group140-2 including cells 140-1 a, 140-2 b, 140-2 c, and 140-2 d that arearranged in row 2 of the grid 141; the cell group 140-3 including cells140-3 a and 140-3 b that are arranged in row 3 of the grid 141; the cellgroup 140-4 including cells 140-4 a, 140-4 b and 140-4 c that arearranged in row 4 of the grid 141; the cell group 140-5 including cells140-5 a, 140-5 b, 140-5 c, and 140-5 d that are arranged in row 5 of thegrid 141; the cell group 140-6 including cells 140-6 a, 140-6 b, and140-6 c that are arranged in row 6 of the grid 141; the cell group 140-7including cells 140-7 a and 140-7 b that are arranged in row 7 of thegrid 141; and the cell 140-8 including cells 140-8 a, 140-8 b, 140-8 c,140-8 d, and 140-8 e that are arranged in row 8 of the grid 141. In someembodiments, the cells of the cell groups 140-1, 140-2, 140-4, 140-5,140-7, and 140-8 may be retrieved from the above-mentioned standard celllibrary B (e.g., same as the cell 100-3 a to 100-3 d of the integratedcircuit 100); and the cells of the cell groups 140-3 and 140-6 may beretrieved from the above-mentioned standard cell library A (e.g., sameas the cells 100-1 a to 100-1 d of the integrated circuit 100). In someembodiments, the rows 1, 2, 4, 5, 7, and 8 of the integrated circuit 140may each have a row height substantially similar to the row height B;and the rows 3 and 6 of the integrated circuit 140 may each have a rowheight substantially similar to the row height A. As such, the cells140-1 a to 140-1 d, 140-2 a to 140-2 d, 140-4 a to 140-c, 140-5 a to140-5 d, 140-7 a to 140-7 b, and 140-8 a to 140-8 e may each have a cellheight that is substantially identical to the cell height B; and thecells 140-3 a to 140-3 b and 140-6 a to 140-6 c may each have a cellheight that is substantially identical to the cell height A.

Referring then to FIG. 1C, the integrated circuit 180 includes cellgroups 180-1, 180-2, 180-3, 180-4, 180-5, and 180-6 arranged (e.g., laidout) in respective “rows” with respect to a grid 181. For example, thecell group 180-1 including cells 180-1 a and 180-1 b that are arrangedin row 1 of the grid 181; the cell group 180-2 including cells 180-2 a,180-2 b, 180-2 c, and 180-2 d that are arranged in row 2 of the grid181; the cell group 180-3 including cells 180-3 a, 180-3 b, and 180-3 cthat are arranged in row 3 of the grid 181; the cell group 180-4including cells 180-4 a, 180-4 b, and 180-4 c that are arranged in row 4of the grid 181; the cell group 180-5 including cells 180-5 a, 180-5 b,180-5 c, and 180-5 d that are arranged in row 5 of the grid 181; and thecell group 180-6 including cells 180-6 a, 180-6 b, 180-6 c, 180-6 d, and180-6 e that are arranged in row 6 of the grid 181. In some embodiments,the cells of the cell groups 180-1, 180-3, and 180-5 may be retrievedfrom the above-mentioned standard cell library A; and the cells of thecell groups 180-2, 180-4, and 180-6 may be retrieved from theabove-mentioned standard cell library B. In some embodiments, the rows1, 3, and 5 of the integrated circuit 180 may each have a row heightsubstantially similar to the row height A; and the rows 2, 4, and 6 ofthe integrated circuit 180 may each have a row height substantiallysimilar to the row height B. As such, the cells 180-1 a to 180-1 b,180-3 a to 180-3 c, and 180-5 a to 180-5 d may each have a cell heightthat is substantially identical to the cell height A; and the cells180-2 a to 180-2 d, 180-4 a to 180-4 c, and 180-6 a to 180-6 e may eachhave a cell height that is substantially identical to the cell height B.

As discussed above, the cell height A corresponds to a higher number ofactive regions disposed along the Y direction, and the cell height Bcorresponds to a lower number of active regions disposed along the Ydirection. Further, in some embodiments, the cell that has a highernumber of active regions may present higher performance (e.g., a fasterspeed) over the cell that has a lower number of active regions, whilethe cell that has a lower number of active regions may occupy a smallerarea, which typically presents lower power consumption as well, over thecell that has a higher number of active regions.

As such, the integrated circuit 100, which includes more cells with thecell height A than one(s) with the cell height B, may present relativelyhigher performance among the integrated circuits 100-180 (i.e., aspeed-orientated circuit); the integrated circuit 140, which includesmore cells with the cell height B than ones with the cell height A, maypresent relatively lower power consumption among the integrated circuits100-180 (i.e., a power/area-orientated circuit); and the integratedcircuit 180, which includes equal numbers of cells with the cell heightsA and B, may present relatively higher performance than the integratedcircuit 180 and relatively lower power consumption than the integratedcircuit 100 (i.e., a balance-orientated circuit). Compared to theexisting techniques to form a balance-orientated circuit, whichtypically has extension discontinuity in one or more respective activeregions, the integrated circuit 180, for example, which is formed by thedisclosed systems and methods, can present a balanced characteristicwithout having the extension discontinuity formed in the respectiveactive regions.

More specifically, depending on the characteristic of a being-designedintegrated circuit, a row ratio, defining a ratio of the number of cellshaving the cell height A to the number of cells having the cell heightB, can be accordingly determined, in accordance with some embodiments ofthe present disclosure. Using the above-provided integrated circuits forexample, while designing the integrated circuit 100 that is intended tohave high performance using the disclosed systems and methods, a higherrow ratio, which is 4 (because the numbers of cells with cell heights Aand B are 4 and 1, respectively), may be determined; while designing theintegrated circuit 140 that is intended to have lower power consumptionusing the disclosed systems and methods, a lower row ratio, which is 1/3(because the numbers of cells with cell heights A and B are 2 and 6,respectively), may be determined; and while designing the integratedcircuit 180 that is intended to have a balanced characteristic using thedisclosed systems and methods, an intermediate row ratio, which is 1(because the numbers of cells with cell heights A and B are 3 and 3,respectively), may be determined. The integrated circuits 100-180 areprovided as illustrative examples. Thus, it is understood that thedisclosed systems and methods can be used to design an integratedcircuit that has any of other row ratios (after reduced a fraction torespective lowest terms) such as, for example, 1/2, 2/3, 3/2, 1/4, 3, 4,etc., while remaining within the scope of the present disclosure.

In accordance with some embodiments of the present disclosure,integrated circuits designed by the disclosed systems and methodsinclude a plurality of rows, and each of the plurality of rows includesone or more side-by-side disposed cells sharing a same cell height.Further, such a same height corresponds to a same number of activeregions, across those side-by-side disposed cells, that runs in adirection substantially orthogonal to another direction along which theplurality of rows are arranged. As such, the active regions of theside-by-side disposed cells can be continuously extended across therespective cells along the row. By continuously extending the activeregions across plural side-by-side cells of an integrated circuit, thecompressive strain within the active regions can be increased, which canadvantageously improve performance of the integrated circuit (e.g., ahigher driving current), while allowing the integrated circuit to bedesigned to have any desired characteristic by arranging two or morerows that have respective different row heights (cell heights), asdiscussed above. Using the integrated circuit 180 as a representativeexample, such continuously extending active regions will be illustratedand discussed in further detail below.

In addition, integrated circuits following a mixed row design of thedisclosed systems and methods can achieve a smaller area, a lower powerconsumption on non-timing critical path, while keeping the fin speed. Inone example, compared to a traditional high speed design, the disclosedintegrated circuit has a same top speed, but reduces power to 70%,reduces the area to 87%, and is strong against fin stress with no finbreak. In another example, compared to a traditional low power design,the disclosed integrated circuit has a same power, a similar area, butincreases the top speed from 70% to 100% (by about 43%), and is strongagainst fin stress with no fin break. In yet another example, comparedto a traditional high speed and partial low power design, the disclosedintegrated circuit has a same power, but increases the top speed from90% to 100% (by about 11%), reduces the area to 87%, and is relativelystrong against fin stress with no fin break.

FIG. 2A illustrates a top view of a corresponding layout design of theintegrated circuit 180 at one or more first layout levels, and FIG. 2Billustrates a top view of the corresponding layout design of theintegrated circuit 180 at a second layout level above the one or morefirst layout levels, in accordance with some embodiments. In some otherembodiments, the second layout level may be below or the same as the oneor more first layout levels. For purposes of clarity, FIGS. 2C and 2Dillustrate part of corresponding cross-sectional views of the cells180-1 a and 180-1 b of the integrated circuit 180 taken along lines A-Aand B-B, respectively.

As shown in FIG. 2A, along the row 1 of grid 181, the cells 180-1 a and180-1 b respectively include four active regions 212-1, 212-2, 212-3,and 212-4 continuously extending along the X direction across the cells180-1 a to 180-1 b; along the row 2 of grid 181, the cells 180-2 a,180-2 b, 180-2 c, and 180-2 d respectively include two active regions222-1 and 222-2 continuously extending along the X direction across thecells 180-2 a to 180-2 d; along the row 3 of grid 181, the cells 180-3a, 180-3 b, and 180-3 c respectively include four active regions 232-1,232-2, 232-3, and 232-4 continuously extending along the X directionacross the cells 180-3 a to 180-3 c; along the row 4 of gird 181, thecells 180-4 a, 180-4 b, and 180-4 c respectively include two activeregions 242-1 and 242-2 continuously extending along the X directionacross the cells 180-4 a to 180-4 c; along the row 5 of grid 180, thecells 180-5 a, 180-5 b, 180-5 c, and 180-5 d respectively include fouractive regions 252-1, 252-2, 252-3, and 252-4 continuously extendingalong the X direction across the cells 180-5 a to 180-5 d; and along therow 6 of grid 181, the cells 180-6 a, 180-6 b, 180-6 c, 180-6 d, and180-6 e respectively include two active regions 262-1 and 262-2continuously extending along the X direction across the cells 180-6 a to180-6 e.

As mentioned above, the active regions of the cells of the integratedcircuit 180 serve as source features or drain features of the respectivetransistors, and each cell of the integrated circuit 180 is configuredto perform a specific logic function. Thus, it is understood that eachcell of the integrated circuit 180 may include a first region implantedwith n-type dopants, a second region implanted with p-type dopants, anda respective plurality of gate patterns. In some embodiments, one subsetof the respective active regions are formed over the first region toform p-type MOSFETs, and the other subset of the respective activeregions are formed over the second region to form n-type MOSFETs.Further, the respective plurality of gate patterns may run in adirection substantially orthogonal to the direction along which theactive regions extend to form respective gates of the p-type and n-typeMOSFETs, in accordance with some embodiments. As such, the cells of theintegrated circuit 180 may present different gate pattern layouts toperform respective specific logic functions.

For example, referring still to FIG. 2A, the cell 180-1 a includes afirst region 214 implanted with n-type dopants and a second region 216implanted with p-type dopants that are divided by a line 215, and gatepatterns 218-1, 218-2, and 218-3 that are spaced apart from each otherby respective distances and each runs in the Y direction. In someembodiments, the active regions 212-1 to 212-4 may be each disposed overeither the first region 214 or the second region 216 and the gatepatterns 218-1 to 218-3 may be each disposed over the respective activeregions 212-1 to 212-4, which will be shown with reference to FIGS. 2Cand 2D. Similarly, the adjacent cell 180-1 b also includes the firstregion 214 and the second region 216 over which the active regions 212-1to 212-4 are disposed, and gate patterns 218-4, 218-5, 218-6, and 218-7that are spaced apart from each other by respective distances and eachruns in the Y direction.

In some embodiments, the active regions of the cells of the integratedcircuit 180 disposed along the other rows are also disposed overrespective first and second implanted regions, and one or morerespective gate patterns also run in the Y direction, such that therespective configurations of the cells of the integrated circuit 180disposed along other rows are briefly described as follows.

Along row 2, the cells 180-2 a to 180-2 d include a first region 224implanted with n-type dopants and a second region 226 implanted withp-type dopants that are divided by a line 225, wherein the active region222-1 is disposed over the first region 224 and the active region 222-2is disposed over the second region 226. The cell 180-2 a furtherincludes gate patterns 228-1, 228-2, and 228-3 that are spaced apartfrom each other by respective distances and each runs in the Ydirection; the cell 180-2 b further includes gate patterns 228-4 and228-5 that are spaced apart from each other by a respective distance andeach runs in the Y direction; the cell 180-2 c further includes gatepatterns 228-6, 228-7, 228-8, and 228-9 that are spaced apart from eachother by respective distances and each runs in the Y direction; and thecell 180-2 d further includes gate patterns 228-10, 228-11, and 228-12that are spaced apart from each other by respective distances and eachruns in the Y direction.

Along row 3, the cells 180-3 a to 180-3 c include a first region 234implanted with n-type dopants and a second region 236 implanted withp-type dopants that are divided by a line 235, wherein the active region232-1 and 232-2 are disposed over the first region 234 and the activeregion 232-3 and 232-4 are disposed over the second region 236. The cell180-3 a further includes gate patterns 238-1, 238-2, and 238-3 that arespaced apart from each other by respective distances and each runs inthe Y direction; the cell 180-3 b further includes gate patterns 238-4,238-5, and 238-6 that are spaced apart from each other by respectivedistances and each runs in the Y direction; and the cell 180-3 c furtherincludes gate patterns 238-7, 238-8, and 238-9 that are spaced apartfrom each other by respective distances and each runs in the Ydirection.

Along row 4, the cells 180-4 a to 180-4 c include a first region 244implanted with n-type dopants and a second region 246 implanted withp-type dopants that are divided by a line 245, wherein the active region242-1 is disposed over the first region 244 and the active region 242-2is disposed over the second region 246. The cell 180-4 a furtherincludes gate patterns 248-1, 248-2, and 248-3 that are spaced apartfrom each other by respective distances and each runs in the Ydirection; the cell 180-4 b further includes gate patterns 248-4, 248-5,and 248-6 that are spaced apart from each other by respective distancesand each runs in the Y direction; and the cell 180-4 c further includesgate patterns 248-7, 248-8, 248-9, and 248-10 that are spaced apart fromeach other by respective distances and each runs in the Y direction.

Along row 5, the cells 180-5 a to 180-5 d include a first region 254implanted with n-type dopants and a second region 256 implanted withp-type dopants that are divided by a line 255, wherein the active region252-1 and 252-2 are disposed over the first region 254 and the activeregion 252-3 and 252-4 are disposed over the second region 256. The cell180-5 a further includes gate patterns 258-1, 258-2, and 258-3 that arespaced apart from each other by respective distances and each runs inthe Y direction; the cell 180-5 b further includes gate patterns 258-4and 258-5 that are spaced apart from each other by a respective distanceand each runs in the Y direction; the cell 180-5 c further includes gatepatterns 258-6, 258-7, and 258-8 that are spaced apart from each otherby respective distances and each runs in the Y direction; and the cell180-5 d further includes gate patterns 258-9, 258-10, and 258-11 thatare spaced apart from each other by respective distances and each runsin the Y direction.

Along row 6, the cells 180-6 a to 180-6 e include a first region 264implanted with n-type dopants and a second region 266 implanted withp-type dopants that are divided by a line 265, wherein the active region262-1 is disposed over the first region 264 and the active region 262-2is disposed over the second region 266. The cell 180-6 a furtherincludes gate patterns 268-1 and 268-2 that are spaced apart from eachother by a respective distance and each runs in the Y direction; thecell 180-6 b further includes gate patterns 268-3 and 268-4 that arespaced apart from each other by a respective distance and each runs inthe Y direction; the cell 180-6 c further includes gate patterns 268-5and 268-6 that are spaced apart from each other by a respective distanceand each runs in the Y direction; the cell 180-6 d further includes gatepatterns 268-7 and 268-8 that are spaced apart from each other by arespective distance and each runs in the Y direction; and the cell 180-6e further includes gate patterns 268-9 and 268-10 that are spaced apartfrom each other and each runs in the Y direction.

In some embodiments, the first and second implanted regions, activeregions, and gate patterns of each cell of the integrated circuit 180may be formed over a substrate on one or more first layout levels, whichwill be shown in the cross-sectional view of FIGS. 2C and 2D. Asmentioned above, FIG. 2B illustrates the top view of the layout designof the integrated circuit 180 at the second layout level above the oneor more first layout levels.

According to some embodiments of the present disclosure, at the secondlayout level, each cell includes a plurality of conductor patternsrunning in the Y direction (i.e., in parallel with the active regions)and over the respective gate patterns. In some embodiments, such asecond layout level, including the plurality of conductor patterns, isdirectly disposed above the one or more first layout levels that includethe gate patterns (i.e., no intermediate layout level disposedtherebetween), which is herein referred to as an “M1 level (the firstmetal level/layer).” Further, the plurality of conductor patterns in theM1 level are each electrically coupled to one or more of theabove-discussed p-type and n-type MOSFETs through at least a viastructure (not shown) thereby allowing each of the p-type and n-typeMOSFETs to be powered, or electrically connect to other MOSFETs ordevices.

As shown in FIG. 2B, the M1 level includes a plurality of conductorpatterns running in the Y direction such as, for example, power rails270-1, 270-2, 270-3, 270-4, 270-5, 270-6, and 270-7, and M1interconnection lines 272-1, 272-2, 272-3, 272-4, 272-5, 272-6, 272-7,272-8, 272-9, 272-10, 272-11, 272-12, 272-13, 272-14, 272-15, 272-16,and 272-17. In some embodiments, when viewing from the top of the M1level, the cells along each row are disposed between two adjacent powerrails that are each configured to carry power signals (e.g., VDD,ground, etc.). Further, between such two adjacent power rails, arespective subset of the M1 interconnection lines, in parallel with oneanother, run over the cells.

For example, the cells of the cell group 180-1 at row 1 are disposedbetween the power rails 270-1 and 270-2 with the M1 interconnectionlines 272-1 to 272-4 running thereupon; the cells of the cell group180-2 at row 2 are disposed between the power rails 270-2 and 270-3 withthe M1 interconnection lines 272-5 to 272-6 running thereupon; the cellsof the cell group 180-3 at row 3 are disposed between the power rails270-3 and 270-4 with the M1 interconnection lines 272-7 to 272-10running thereupon; the cells of the cell group 180-4 at row 4 aredisposed between the power rails 270-4 and 270-5 with the M1interconnection lines 272-11 to 272-12 running thereupon; the cells ofthe cell group 180-5 at row 5 are disposed between the power rails 270-5and 270-6 with the M1 interconnection lines 272-13 to 272-16 runningthereupon; and the cells of the cell group 180-6 at row 6 are disposedbetween the power rails 270-6 and 270-7 with the M1 interconnectionlines 272-17 to 272-18 running thereupon.

In some embodiments, the number of M1 interconnection lines running overa cell may correspond to the number of active regions included in thecell. More specifically, for a row with a greater row height (i.e., thecells therein each having a higher number of active regions), more M1interconnection lines may be included, while for a row with a shorterrow height (i.e., the cells therein each having a lower number of activeregions), less M1 interconnection lines may be included. For example,the number of M1 interconnection lines running over cells disposed atrow 1, which have 4 active regions (e.g., 212-1 to 212-4), may be morethan the number of M1 interconnection lines running over cells disposedat row 2, which have 2 active regions (e.g., 222-1 and 222-2). In theillustrated embodiment of FIG. 2B, the number of M1 interconnectionlines disposed at row 1 is 4 (equal to the number of active regions ofthe cells at row 1) and the number of M1 interconnection lines disposedat row 2 is 2 (equal to the number of active regions of the cells at row2). However, it is understood that the number of M1 interconnectionlines is not limited to be equal to the number of active regions runover by the M1 interconnection lines.

Further, in some embodiments, each of the M1 interconnection lines 272-1to 272-17 may share a substantially conformal width 273 along the Xdirection, and may be separated apart from adjacent M1 interconnectionline(s) or power rail(s) by a substantially similar distance 275. Such adesign constraint on the formation of M1 interconnection lines mayadvantageously ease the design complexity. For example, the M1interconnection line 272-2 has the conformal width 273 along the Xdirection, and is separated apart from the M1 interconnection lines272-1 and 272-3 by the distance 275, respectively.

Referring to FIGS. 2C and 2D, the cross-sectional views of the cells180-1 a and 180-1 b at the first one or more layout levels and takenalong the lines A-A and B-B, respectively, are shown, in accordance withsome embodiments. As respectively shown in FIGS. 2C and 2D, the firstregion 214 implanted with n-type dopants, herein referred to as “n-well214,” is disposed over a substrate 280; and the second region 216implanted with p-type dopants, herein referred to as “p-well 216,” isdisposed over the substrate 280. In some embodiments, the substrate 280includes Si, Ge, SiGe, InAs, InGaAs, InAlAs, InP, or the like; then-well 214 includes Si, Ge, SiGe, InAs, InGaAs, InAlAs, InP, or thelike; and the p-well 216 includes Si, Ge, SiGe, InAs, InGaAs, InAlAs,InP, or the like. In some embodiments, when the substrate 280 includesSi, the n-well 214 may also include Si but doped with n-type dopants,e.g., P, As, or the like, and the p-well 246 may also include Si butdoped with p-type dopants, e.g., B, Ga, or the like.

In some embodiments, the n-well 214 may further includes a first set ofregions 280-1, 280-2, 280-3, 280-4, and 280-5 implanted with p-typedopants in an elevated doping concentration; and the p-well 216 mayfurther includes a second set of regions 282-1, 282-2, 282-3, 282-4, and282-5 implanted with n-type dopants in an elevated doping concentration.Such first and second sets of implanted regions 280-1 to 280-5 and 282-1to 282-5, each of which is disposed between two adjacent gate patternsin the X direction, may serve as sources or drains of the respectiveMOSFETs. For example, in FIG. 2C, the region 280-1, disposed between thegate patterns 218-1 and 218-2, may serve as either a source or drain ofa p-type MOSFET that has the gate pattern 218-1 or 218-2 as its gate;and in FIG. 2D, the region 282-2, disposed between the gate patterns218-2 and 218-3, may serve as either a source or drain of an n-typeMOSFET that has the gate pattern 218-2 or 218-3 as its gate.

In the illustrated embodiments of FIGS. 2C and 2D, although therespective “side” gate patterns 218-3 and 218-4 of the adjacent cells180-1 a and 180-1 b are merged together to form a single gate pattern,such side gate patterns may be separated from each other by asource/drain while remaining within the scope of the present disclosure.In other embodiments as shown in FIGS. 2E and 2F, the adjacent cells180-1 a and 180-1 b do not share a side gate pattern, but have a cellboundary in the middle of a shallow trench isolation (STI) 290, 292between the side gate patterns 218-3 and 218-4.

According to some embodiments, the n-well 214, which includes the firstset of implanted regions 280-1 to 280-5, may form a portion of thecontinuously extending active region 212-1, as shown in FIG. 2C; and thep-well 216, which includes the second set of implanted regions 282-1 to282-5, may form a portion of the continuously extending active region212-3, as shown in FIG. 2D.

FIG. 2G illustrates a top view of another corresponding layout design ofthe exemplary integrated circuit 180 at one or more first layout levels,in accordance with some embodiments of the present disclosure. In thisembodiment, as shown in FIG. 2G, each of the gate patterns 218-1 to218-7 forms a straight line through different rows of the integratedcircuit 180. That is, in each of the gate patterns 218-1 to 218-7, polygates in different rows align with each other along a same line in the Ydirection. But the poly gates in different rows may be separated orisolated at the boundary between two adjacent rows. That is, each lineof the gate patterns 218-1 to 218-7 may have a break at the boundarybetween two adjacent rows.

Referring now to FIG. 3, a block diagram of an information handlingsystem (IHS) 300 is provided, in accordance with some embodiments of thepresent invention. The IHS 300 may be a computer platform used toimplement any or all of the processes discussed herein to design anintegrated circuit with mixed row heights (e.g., the integrated circuits100, 140, and 180). The IHS 300 may comprise a processing unit 310, suchas a desktop computer, a workstation, a laptop computer, or a dedicatedunit customized for a particular application. The HIS 300 may beequipped with a display 314 and one or more input/output (I/O)components 312, such as a mouse, a keyboard, or printer. The processingunit 310 may include a central processing unit (CPU) 320, memory 322, amass storage device 324, a video adapter 326, and an I/O interface 328connected to a bus 330.

The bus 330 may be one or more of any type of several bus architecturesincluding a memory bus or memory controller, a peripheral bus, or videobus. The CPU 320 may comprise any type of electronic data processor, andthe memory 322 may comprise any type of system memory, such as staticrandom access memory (SRAM), dynamic random access memory (DRAM), orread-only memory (ROM).

The mass storage device 324 may comprise any type of storage deviceconfigured to store data, programs, and other information and to makethe data, programs, and other information accessible via the bus 330.The mass storage device 324 may comprise, for example, one or more of ahard disk drive, a magnetic disk drive, an optical disk drive, or thelike.

The video adapter 326 and the I/O interface 328 provide interfaces tocouple external input and output devices to the processing unit 310. Asillustrated in FIG. 3, examples of input and output devices include thedisplay 314 coupled to the video adapter 326 and the I/O components 312,such as a mouse, keyboard, printer, and the like, coupled to the I/Ointerface 328. Other devices may be coupled to the processing unit 310,and additional or fewer interface cards may be utilized. For example, aserial interface card (not shown) may be used to provide a serialinterface for a printer. The processing unit 310 also may include anetwork interface 340 that may be a wired link to a local area network(LAN) or a wide area network (WAN) 316 and/or a wireless link.

It should be noted that the IHS 300 may include othercomponents/devices. For example, the IHS 300 may include power supplies,cables, a motherboard, removable storage media, cases, and the like.These other components/devices, although not shown, are considered partof the IHS 300.

In some embodiments of the present invention, an Electronic DesignAutomation (EDA) is program code that is executed by the CPU 320 toanalyze a user file to obtain the layout of an integrated circuit (e.g.,the integrated circuits 100, 140, and 180 discussed above). Further,during the execution of the EDA, the EDA may analyze functionalcomponents of the layout, as is known in the art. The program code maybe accessed by the CPU 320 via the bus 330 from the memory 322, massstorage device 324, or the like, or remotely through the networkinterface 340.

FIG. 4 illustrates a flow chart of an exemplary method 400 performed bythe IHS 300 to generate a physical layout of an integrated circuit thatincludes mixed row heights, in accordance with some embodiments of thepresent disclosure. In some embodiments, such a method 400 may becollectively referred to as an EDA. In various embodiments, theoperations of the method 400 are performed by the respective componentsillustrated in FIG. 3. For purposes of discussion, the followingembodiment of the method 400 will be described in conjunction with FIG.3. The illustrated embodiment of the method 400 is merely an example.Therefore, it should be understood that any of a variety of operationsmay be omitted, re-sequenced, and/or added while remaining within thescope of the present disclosure.

The method 400 starts with provision operations of“behavioral/functional design 402,” “design constraints 404,” and “mixedrow heights 406.” In some embodiments, the behavioral/functional design402 specifies the desired behavior or function of an integrated circuit(e.g., the integrated circuits 100, 140, and/or 180 discussed above)based upon various signals or stimuli applied to the inputs of anoverall design of the integrated circuit, and may be written in asuitable language, such as a hardware description language (HDL). Thebehavioral/functional design 402 may be uploaded into the processingunit 310 through the I/O interface 328 (FIG. 3), such as by a usercreating the file while the EDA is executing. Alternatively, thebehavioral/functional design 402 may be uploaded and/or saved on thememory 322 or mass storage device 324, or the behavioral/functionaldesign 402 may be uploaded through the network interface 340 from aremote user (FIG. 3). In these instances, the CPU 320 will access thebehavioral/functional design 402 during execution of the EDA.

Further, the user also provides the design constraints 404 in order toconstrain the overall design of a physical layout of thebehavioral/functional design 402. In some embodiments, the designconstraints 404 may be input, for example, through the I/O interface328, downloading through the network interface 340, or the like. Thedesign constraints 404 may specify timing, process parameters, and othersuitable constraints with which the behavioral/functional design 402,once physically formed into an integrated circuit, must comply.

Still further, the user may also provide the mixed row heights 406 inorder to allow the physical layout of the behavioral/functional design402 to be arranged in a plurality of rows, which have at least tworespective different row heights. In some embodiments, the mixed rowheights 406 may be input, for example, through the I/O interface 328,downloading through the network interface 340, or the like. The mixedrow heights 404 may specify a row ratio (i.e., a ratio of the numbers ofrows having respective different row heights as described above),respective locations of the rows having respective different row heightswith respect to a grid of the physical layout, and/or other suitableconstraints with which the behavioral/functional design 402, oncephysically formed into an integrated circuit, must comply.

After the behavioral/functional design 402, the design constraints 404,and the mixed row heights 406 are provided, the method 400 continues tooperation “synthesis 408” to create a functionally equivalent logicgate-level circuit description, such as a netlist. The synthesis 408forms the functionally equivalent logic gate-level circuit descriptionby matching the behavior and/or functions desired from thebehavioral/functional design 402 to (standard) cells from a set of celllibraries 409, while simultaneously meeting the constraints specified bythe design constraints 404 and mixed row heights 406.

In some embodiments, the set of cell libraries 409 may include aplurality of cell libraries that have respective different cell heightssuch as, for example, cell library 411, cell library 413, etc. In someembodiments, the cell libraries 411 and 413 may correspond to theabove-described cell library A and cell library B, respectively. Each ofthe plurality of cell libraries contains a listing of pre-designedcells, each of which is with a common cell height and may perform aspecific logic function on a small scale. For example, the cells of thecell library A 411 may share the cell height A, and the cells of thecell library A 411 may share the cell height B. The cell is stored inthe cell libraries (e.g., the cell library A 411, the cell library B413, etc.) as information comprising internal circuit elements, thevarious connections to these circuit elements, a pre-designed physicallayout pattern that includes the cell height, dopant types, dopingconcentrations, wells, and the like. Additionally, the stored cell mayalso comprise a shape of the cell, terminal positions for externalconnections, delay characteristics, power consumption, and the like.

Once the synthesis 408 generates the functionally equivalent logicgate-level circuit description from the behavioral/functional design402, the design constraints 404, and the mixed row heights 408 by usingthe cells of the set of cell libraries 409 (e.g., the cell library A411, the cell library B 413, etc.), the method 400 continues to a firstdetermination operation 414 to check whether design requirements arematched. In some embodiments, in the first determination operation 414,various requirements may be checked such as, for example, a ratio ofavailable cells in the cell library A 411 to available cells in the celllibrary B 413, a timing quality of the functionally equivalent logicgate-level circuit description, a power quality of the functionallyequivalent logic gate-level circuit description, etc., by performing oneor more simulations using circuit simulators, e.g. Simulation Programwith Integrated Circuit Emphasis (SPICE). If all the design requirementsin the first determination operation 414 are met, the method 400continues to operation “place and route 418,” which will be discussed infurther detail below. On the other hand, if not all of the designrequirements in the first determination operation 414 are met, themethod 400 continues to operation “find root causes 416,” which willalso be discussed in further detail below.

The place and route 418 is performed to generate an actual physicaldesign for the overall structure. The place and route 418 forms thephysical design by taking the chosen cells from the set of celllibraries 409 and placing them into respective rows. In someembodiments, a first set of such rows have a first row heightsubstantially similar to the height of a majority of the cells disposedwithin the first set of rows such that the power rails, implants andwells may be aligned between the cells; and a second set of such rowshave a second row height, different from the first row height,substantially similar to the height of a majority of the cells disposedwithin the second set of rows such that the power rails, implants andwells may be aligned between the cells. The placement of each cellwithin the cell rows, and the placement of each cell row in relation toother cell rows, may be guided by cost functions in order to minimizewiring lengths and area requirements of the resulting integratedcircuit. This placement may be done either automatically by the placeand route 418, or else may alternatively be performed partly through amanual process, whereby a user may manually insert one or more cellsinto a row.

Once the placement and route 418 finishes generating the actual physicaldesign for the overall structure, the method 400 continues to a seconddetermination operation 420 to check whether design requirements arematched. In some embodiments, in the second determination operation 420,various requirements may be checked such as, for example, a ratio ofavailable cells in the cell library A 411 to available cells in the celllibrary B 413 after the placement and route 418, a timing quality of theactual physical design for the overall structure, a power quality of theactual physical design for the overall structure, whether a localcongestion issue exists, etc., by performing one or more simulationsusing circuit simulators, e.g. Simulation Program with IntegratedCircuit Emphasis (SPICE). If all the design requirements in the seconddetermination operation 420 are met, the method 400 continues tooperation “manufacturing tool 422,” which will be discussed in furtherdetail below. On the other hand, if not all of the design requirementsin the second determination operation 420 are met, the method 400continues to the find root causes 416, which will be discussed asfollows.

According to some embodiments, the find root causes 416 is performed tofind the causes resulting in the failure of meeting the designrequirements in either the first determination operation 414 or thesecond determination operation 420. Various causes may result in thefailure. Based on which of the causes is or are, the method 400 mayproceed to a respective operation to re-perform that operation. Forexample, when the cause is due to poor power, performance, area (PPA)characteristics of the cells used to generate the functionallyequivalent logic gate-level circuit description and/or a lack ofavailable cells in the set of cell libraries 409, the method 400 mayproceed to an operation to re-assess the qualities/quantities of thecells of the set of cell libraries 409; when the cause is due to anincorrect arrangement of row(s), the method 400 may proceed back to themixed row heights 406 to re-assess the constraints specified therein;when the cause is due to an infeasibility of synthesizing thefunctionally equivalent logic gate-level circuit description, the method400 may proceed back to the design constraints 404 to re-assess theconstraints specified therein; and when cause is due to an infeasibilityof generating the actual physical design, the method 400 may proceedback to the place and route 418 to re-place and/or re-route.

Referring again to the second determination operation 420, once aphysical design has been successfully generated by the place and route418 while meeting all the design requirements, the method 400 continuesto operation “manufacturing tool 422” to generate, e.g.,photolithographic masks, that may be used in physically manufacturingthe physical design. The physical design may be sent to themanufacturing tool 422 through that LAN/WAN 316.

FIG. 5 illustrates different applications for various mixed row designscenarios, in accordance with some embodiments of the presentdisclosure. FIG. 5 shows five exemplary IC applications each of whichcorresponds to a different type of mixed row design. The mixed rowdesigns 512, 522, 532, 542, 552, have different mixed row ratios betweenRow-A and Row-B, wherein Row-A represents a quantity of rows thatinclude cells from cell library A, and Row-B represents a quantity ofrows that include cells from cell library B. In this example, the cellheight of each cell from cell library A is larger than the cell heightof each cell from cell library B.

For example, a “speed best” circuit 510 desired for a highest speed canbe achieved by the mixed row design 512 that has a mixed row ratio of3:1, which means the ratio between Row-A (a quantity of rows thatinclude cells from cell library A) and Row-B (a quantity of rows thatinclude cells from cell library B) is 3:1 in the mixed row design 512.This is because more cells with larger cell heights can help improvingthe speed.

In another example, a “power/area best” circuit 550 desired for asmallest area and lowest power consumption can be achieved by the mixedrow design 552 that has a mixed row ratio of 1:3, which means the ratiobetween Row-A (a quantity of rows that include cells from cell libraryA) and Row-B (a quantity of rows that include cells from cell library B)is 1:3 in the mixed row design 552. This is because more cells withsmaller cell heights can help saving the circuit area and decreasing thepower consumption.

In another example, a “balanced” circuit 530 can be achieved by themixed row design 532 that has a mixed row ratio of 1:1, which means theratio between Row-A (a quantity of rows that include cells from celllibrary A) and Row-B (a quantity of rows that include cells from celllibrary B) is 1:1 in the mixed row design 532. The “balanced” circuit530 will keep a balance between speed performance, which is not too highor too low, and area/power performance, where the area is not too big ortoo small and the power consumption is not too high to too low.

In yet another example, a “speed oriented” circuit 520 desired for ahigh but not highest speed can be achieved by the mixed row design 522that has a mixed row ratio of 2:1, which means the ratio between Row-A(a quantity of rows that include cells from cell library A) and Row-B (aquantity of rows that include cells from cell library B) is 2:1 in themixed row design 522.

In still another example, a “power/area oriented” circuit 540 desiredfor a high but not highest power/area performance can be achieved by themixed row design 542 that has a mixed row ratio of 1:2, which means theratio between Row-A (a quantity of rows that include cells from celllibrary A) and Row-B (a quantity of rows that include cells from celllibrary B) is 1:2 in the mixed row design 542.

FIG. 6 illustrates an exemplary procedure for designing an integratedcircuit that includes mixed row heights, in accordance with someembodiments of the present disclosure. At operation 610, at least twosets of libraries: Library A and Library B, are designed. The cells indifferent libraries have different cell heights and/or different numberof metal lines. For example, a Library A cell has a higher cell heightand five metal lines while a Library B cell has a lower cell height andthree metal lines. At operation 620, a balanced design scenario ischosen to keep a mixed row ratio of 1:1 between the cells of the twolibraries. At operation 630, a mixed row floorplan is initialized with aspecified placement constraint for Library A and Library B based on thebalanced mixed row ratio of 1:1.

In an embodiment, an integrated circuit structure includes: a firstplurality of cell rows extending in a first direction, each of which hasa first row height and comprises a plurality of first cells disposedtherein; and a second plurality of cell rows extending in the firstdirection, each of which has a second row height different from thefirst row height and comprises a plurality of second cells disposedtherein. The plurality of first cells comprises a first plurality ofactive regions each of which continuously extends across the pluralityof first cells in the first direction, and wherein the plurality ofsecond cells comprises a second plurality of active regions each ofwhich continuously extends across the plurality of second cells in thefirst direction.

In another embodiment, an integrated circuit structure includes: aplurality of first cells each having a first cell height, wherein afirst subset of the plurality of first cells are disposed along a firstdirection in a first cell row; and a plurality of second cells eachhaving a second cell height different from the first cell height,wherein a second subset of the plurality of second cells are disposedalong the first direction in a second cell row different from the firstcell row. The plurality of first cells each comprises a first pluralityof active regions that each continuously extends across the first subsetof the plurality of first cells, and wherein the plurality of secondcells each comprises a second plurality of active regions that eachcontinuously extends across the second subset of the plurality of secondcells.

In yet another embodiment, an integrated circuit designing systemincludes: a non-transitory storage medium encoded with a set ofinstructions; and a hardware processor communicatively coupled with thenon-transitory storage medium and configured to execute the set ofinstructions, the set of instructions being configured to cause theprocessor to: provide a first library comprising a plurality of firstcells that each comprises a first plurality of active regionscontinuously extending along a first direction; provide a second librarycomprising a plurality of second cells that each comprises a secondplurality of active regions continuously extending along the firstdirection, wherein respective numbers of the first and secondpluralities of active regions are different from each other; retrieve afirst subset of the plurality of first cells from the first libraryand/or a second subset of the plurality of second cells from the secondlibrary; and place the first subset of the plurality of first cellsextending along the first direction in a first plurality of cell rowsand/or the second subset of the plurality of second cells extendingalong the first direction in a second plurality of cell rows.

The foregoing outlines features of several embodiments so that thoseordinary skilled in the art may better understand the aspects of thepresent disclosure. Those skilled in the art should appreciate that theymay readily use the present disclosure as a basis for designing ormodifying other processes and structures for carrying out the samepurposes and/or achieving the same advantages of the embodimentsintroduced herein. Those skilled in the art should also realize thatsuch equivalent constructions do not depart from the spirit and scope ofthe present disclosure, and that they may make various changes,substitutions, and alterations herein without departing from the spiritand scope of the present disclosure.

What is claimed is:
 1. An integrated circuit structure, comprising: aplurality of first cell rows extending in a first direction, each ofwhich has a first row height and comprises a plurality of cells disposedtherein, wherein for each first cell row of the plurality of first cellrows: each cell in the first cell row has a cell height equal to thefirst row height, and the first cell row comprises a first plurality ofactive regions each of which continuously extends across the first cellrow in the first direction; and a plurality of second cell rowsextending in the first direction, each of which has a second row heightdifferent from the first row height and comprises a plurality of cellsdisposed therein, wherein for each second cell row of the plurality ofsecond cell rows: each cell in the second cell row has a cell heightequal to the second row height, and the second cell row comprises asecond plurality of active regions each of which continuously extendsacross the second cell row in the first direction.
 2. The integratedcircuit structure of claim 1, wherein a first quantity of the firstplurality of active regions is associated with the first row height, anda second quantity of the second plurality of active regions isassociated with the second row height.
 3. The integrated circuitstructure of claim 2, wherein the first quantity is different from thesecond quantity.
 4. The integrated circuit structure of claim 1, whereineach active region of the first and second pluralities of active regionscomprises a region with a fin-shaped structure.
 5. The integratedcircuit structure of claim 1, wherein the pluralities of first andsecond cell rows are arranged in an alternating configuration along asecond direction perpendicular to the first direction, such that everytwo adjacent cell rows along the second direction comprise a first cellrow and a second cell row.
 6. The integrated circuit structure of claim1, wherein the pluralities of first and second cell rows are mixed,along a second direction perpendicular to the first direction, accordingto a ratio between a number of the plurality of first cell rows and anumber of the plurality of second cell rows.
 7. The integrated circuitstructure of claim 6, wherein the ratio is one of the following: 1/2,1/3, 1/4, 2/3, 3/2, 2/1, 3/1, 4/1, and 1/1.
 8. An integrated circuitstructure, comprising: a plurality of first cells each having a firstcell height, wherein a first subset of the plurality of first cells aredisposed along a first direction to form a first cell row; and aplurality of second cells each having a second cell height differentfrom the first cell height, wherein a second subset of the plurality ofsecond cells are disposed along the first direction to form a secondcell row different from the first cell row, wherein the plurality offirst cells each comprises a first plurality of active regions that eachcontinuously extends across the first subset of the plurality of firstcells, and wherein the plurality of second cells each comprises a secondplurality of active regions that each continuously extends across thesecond subset of the plurality of second cells.
 9. The integratedcircuit structure of claim 8, wherein a first quantity of the firstplurality of active regions is associated with the first cell height,and a second quantity of the second plurality of active regions isassociated with the second cell height.
 10. The integrated circuitstructure of claim 8, wherein a first quantity of the first plurality ofactive regions is different from a second quantity of the secondplurality of active regions.
 11. The integrated circuit structure ofclaim 8, wherein the first and second pluralities of active regions eachcomprises a region with a fin-shaped structure.
 12. The integratedcircuit structure of claim 8, wherein a third subset of the plurality offirst cells are disposed along the first direction in a third cell rowdifferent from the first and second cell rows, and a fourth subset ofthe plurality of second cells are disposed along the first direction ina fourth cell row different from the first and second cell rows.
 13. Theintegrated circuit structure of claim 12, wherein the first, second,third, and fourth cell rows are arranged in an alternating configurationalong a second direction perpendicular to the first direction.
 14. Anintegrated circuit designing system, comprising: a non-transitorystorage medium encoded with a set of instructions; and a hardwareprocessor communicatively coupled with the non-transitory storage mediumand configured to execute the set of instructions, the set ofinstructions being configured to cause the processor to: provide a firstlibrary comprising a plurality of first cells that each comprises afirst plurality of active regions continuously extending along a firstdirection; provide a second library comprising a plurality of secondcells that each comprises a second plurality of active regionscontinuously extending along the first direction, wherein respectivenumbers of the first and second pluralities of active regions aredifferent from each other; retrieve a first subset of the plurality offirst cells from the first library and/or a second subset of theplurality of second cells from the second library; and place the firstsubset of the plurality of first cells extending along the firstdirection to form a first plurality of cell rows and/or the secondsubset of the plurality of second cells extending along the firstdirection to form a second plurality of cell rows.
 15. The integratedcircuit designing system of claim 14, wherein a first quantity of thefirst plurality of active regions is associated with a first cell heightof the plurality of first cells, and a second quantity of the secondplurality of active regions is associated with a second cell height ofthe plurality of second cells.
 16. The integrated circuit designingsystem of claim 14, wherein the first and second pluralities of activeregions each comprises a region with a fin-shaped structure.
 17. Theintegrated circuit designing system of claim 14, wherein: in each of thefirst plurality of cell rows, the respective first pluralities of activeregions of the first subset of the plurality of first cells continuouslyextend across the first subset of the plurality of first cells, and ineach of the second plurality of cell rows, the respective secondpluralities of active regions of the second subset of the plurality ofsecond cells continuously extend across the second subset of theplurality of second cells.
 18. The integrated circuit designing systemof claim 14, wherein the set of instructions are configured to furthercause the processor to: place the first and second pluralities of cellrows along a second direction perpendicular to the first direction toform a layout of an integrated circuit.
 19. The integrated circuitdesigning system of claim 18, wherein the set of instructions areconfigured to further cause the processor to: based on a performancerequirement of the integrated circuit, determine an arrangement of thefirst and second pluralities of cell rows along the second direction.20. The integrated circuit designing system of claim 19, wherein the setof instructions are configured to further cause the processor to: basedon the performance requirement of the integrated circuit, determine aratio of a number of the first plurality of cell rows to a number of thesecond plurality of cell rows arranged along the second direction.